Lenovo High Density Server
Lenovo ThinkSystem SD650 Server
- Form Factor: Full-wide 1U tray (six per n1200 Enclosure)
- Chassis : NeXtScale n1200 Enclosure (6U)
- Processors: 2 second-generation Intel Xeon Scalable Processor Scalable family CPUs per node; 2x nodes per 1U tray
- Memory Up to 1.5TB using 12x 2933MHz TruDDR4 DIMMs per node or up to 2TB (512GB x4) using Intel Optane DC Persistent Memory
- I/O Expansion: 1x 50mm width ML2 slot and 1x PCIe x16 slot for EDR InfiniBand or Intel Omni Path, per server node
- Internal Storage: Up to 2x 2.5” SATA SSDs (7mm height) or 1x 2.5” NVMe SSDs (15mm height) per node; up to 2x M.2 SATA SSDs
- RAID Support: Onboard SATA controller with SW RAID; optional Dual M.2 SSD adapter with HW RAID 1
- Network Interface: 2x 1GbE BaseT NIC per node; additional high-speed network adapters (InfiniBand or Omni Path) can be installed in available front-accessible PCIe x16 adapter slot
- Power Management: Rack-level power capping and management via Extreme Cloud Administration Toolkit (xCAT)
- Systems Management: Supported by LICO and XCC
- Limited Warranty: 3-year customer replaceable unit and onsite limited warranty, next business day 9x5, service upgrades available
Lenovo ThinkSystem SD530 Server
- Form Factor/Height: 2U rack enclosure; 4 independent compute nodes
- Processor (max)/Cache (max): Up to 2x Intel® Xeon® Platinum processors, up to 165W
- Memory: Up to 1TB in 16x slots, using 64GB DIMMs; 2666MHz TruDDR4
- Expansion Slots: 1x shuttle per D2 enclosure: either x8 PCIe Shuttle with 8x PCIe 3.0 x8 slots (2 per node); or x16 PCIe Shuttle with 4x PCIe 3.0 x16 slots (1 per node). Up to 2x external 1U trays (with up to 2 GPUs per node each)
- Drive Bays (Total/Hot Swap)
- Up to 24x (6x per node) HS SFF SAS/SATA HDDs/SSDs; up to 8x (2x per node) HS SFF NVMe SSDs
- RAID Support: SW RAID supports JBOD; Entry RAID; opt. HW RAID 12Gb supports JBOD; plus M.2 boot support with optional RAID
- Security and Availability Features TPM 1.2/2.0; PFA; HS/redundant drives, fans, and PSUs; 45°C continuous operation; light path diagnostic LEDs; front-access diagnostics via dedicated USB port
- Network Interface: Opt. 8-port EIOM 10Gb SFP+ (two ports per node); Opt. 8-port EIOM 10GbaseT RJ45 (two ports per node)
- Power Supply: 2x hot-swap/redundant 1+1 1600W/2000W; or 2x non-redundant 1100W
- Hot-Swap Components Power supplies, fans, SAS/SATA/NVMe storage devices; compute nodes are warm-swap
- Systems Management: XClarity Controller embedded management, XClarity Administrator centralized infrastructure delivery, XClarity Integrator plugins, and XClarity Energy Manager centralized server power management
- Operating Systems Supported
- Microsoft Windows Server, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware vSphere. Visit lenovopress.com/osig for details.
- Limited Warranty: 1- and 3-year customer replaceable unit and onsite service, next business day 9x5, opt. service upgrades
Lenovo Scalable Infrastructure Server
- Operating Systems: Red Hat Enterprise Linux, SUSE Linux Enterprise Server, CentOS
- Lenovo Software: Lenovo intelligent Computing Orchestration (LiCO)
- OEM Software: IBM® Spectrum Scale, Excelero
- Open Source Software: xCat/Confluent, Antilles
- Scalability Individual configuration based on the components above scaling from single to 10,000s of systems
- Warranty: 3-year parts, customer replaceable unit (CRU) or on-site labor, limited warranty, with individual nodes retaining the warranty and service upgrade offerings for that machine type; optional warranty service upgrades. Support is 9x5, next business day
Lenovo Distributed Storage Solution for IBM Spectrum Scale
- Single, integrated storage solution
- Built to leverage a strong IBM Spectrum Scale software market
- High-capacity, scalable building-block approach—performance and capacity increase as you add multiple building blocks
- Unique, innovative Spectrum Scale RAID capability providing extreme data integrity and reduced latency with faster rebuild times and enhanced data protection
- Cost competitive
Lenovo ThinkSystem SD650N V2 High Density Server
Sever Brand: Lenovo
Server Product: ThinkSystem SD650N V2 High Density Server
Form Factor/Height: 6U rack-mount with 6 trays
Processor Structure: 2x 3rd Gen Intel Xeon Scalable processors per node
Memory: Up to 2.0TB using 16x 128GB 3200MHz TruDDR4 RDIMMs per tray
Storage: 2x 2.5-inch slim SATA / NVMe U.2 SSD and 2x M.2 SATA SSD SW RAID and Intel VROC for Intel drives only
NIC: 1x SFP28 25Gb LOM, NCSI 1x RJ45 1GbE, NCSI
PCIe: 2x x16 PCIe Gen4 LP per tray
Power Supply: 6/9 N+1 redundant hot-swap PSUs (up to 2400W Platinum)
Cooling System: Direct Water Cooling with up to 50C inlet water temperature
Management: Lenovo XClarity Controller (XCC) and Lenovo Intelligent Computing Orchestration (LiCO)
OS Support: Red Hat Enterprise Linux, SUSE Linux Enterprise Server Tested on CentOS
Acceleration: NVIDIA HGX A100 4-GPU with 4x NVLink connected SXM4 GPUs
Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)
Lenovo ThinkSystem SD650 V3 High Density Server
Sever Brand: Lenovo
Server Product: ThinkSystem SD650 V3 High-Density Server
Form Factor: Full-wide 1U tray (two SD650 V3 nodes per tray, six per DW612S Enclosure)
Chassis: DW612S Enclosure (6U)
Processors Structure: Two 4th Gen Intel Xeon Scalable processors per node, or 2x 4th Gen Intel Xeon CPU Max series processors with HBM per node; 2x nodes per 1U tray
RAM : Up to 2.0TB using 16x 128GB 4800 MHz per node
I/O Expansion: Up to 2x PCIe Gen5 x16 low-profile adapter slots (2x supported without internal storage) per node for NDR InfiniBand. Shared I/O and SocketDirect supported.
Internal Storage: Up to 4x 2.5 SATA/NVMe SSDs (7mm height) or 2x 2.5 NVMe SSDs (15mm height) per node; up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions
RAID Support: Onboard SATA controller with SW RAID or Intel VROC
Network Interface: Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI)
Power Management: Rack-level power capping and management via open-source management software Confluent and application-level energy optimization through Energy Aware Runtime (EAR)
Systems Management: Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements
Front access: All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External Diagnostics Handset port for local management.
Rear access: 2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection
Power Supply: Up to 9x air CFF v4 (2400W PT, 2600W TT) ; Up to 3x Direct Water Cooled Power Supply (7200W) 80+ Titanium; N+1 redundancy (only air-cooled / without acceleration on DWC)
Cooling Design: Direct Water Cooling at the heat source with up to 45C inlet water temperature
OS Support: Red Hat, SUSE, Rocky Linux (with LeSI support); Visit lenovopress.com/osig for more information.
Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)
Lenovo ThinkSystem SD650I V3 High Density Server
Sever Brand: Lenovo
Server Product: ThinkSystem SD650I V3 High Density Server
Form Factor/Height: 6U rack-mount with 6 trays
Processor Structure: 2x 4th Gen Intel Xeon Scalable processors per tray or 2x Intel Xeon CPU Max processors per tray
Ram: Up to 2.0TB using 16x 128GB 4800 MHz TruDDR5 RDIMMs per tray
Storage: Up to 4x 7mm or 2x 15mm U.2/SATA, no drive/backplane choice and 1 x liquid cooled M.2 NVMe SSD, providing both the boot drive and storage function SW RAID and Intel VROC for Intel drives only
NIC: 2 x SFP28 25Gb LOM, NCSI (10Gb capable); 1x RJ45 1GbE, NCSI
PCIe: 2x x16 PCIe Gen5 LP per tray
Power Supply: Up to 9x air CFF v4 (2400W PT, 2600W TT); Up to 3x Direct Water Cooled Power Supply (7200W) 80+ Titanium
Cooling System: Direct Water Cooling with up to 50C inlet water temperature
Management: Lenovo XClarity Controller (XCC) and Lenovo Intelligent Computing Orchestration (LiCO)
OS Support: Red Hat Enterprise Linux, SUSE Linux Enterprise Server
Acceleration: Four Intel Data Center GPU Max <=600W TDP
Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)
Lenovo ThinkSystem SD665 V3 High Density Server
Sever Brand: Lenovo
Server Product: ThinkSystem SD665 V3 Server
Form Factor: Full-wide 1U tray; 2 nodes per tray
Chassis: DW612S Enclosure (6U)
Processors Structure: 2x 4th Generation AMD EPYC Processors per node
RAM: Up to 3.0TB using 24x 128GB 4800 MHz TruDDR5 RDIMM slots per tray
I/O Expansion: Up to 2x PCIe Gen5 x16 low-profile adapter slots (2x supported without internal storage) per node for NDR InfiniBand. Shared I/O and SocketDirect supported.
Internal Storage: Up to 4x 2.5-inch NVMe SSDs (7mm height) or 2x 2.5-inch NVMe SSDs (15mm height) per node; up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions
RAID Support: OS Software RAID
Network Interfaces: Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI)
Power Management: Rack-level power capping and management via open-source management software Confluent and application-level energy optimization through Energy Aware Runtime (EAR)
Systems Management: Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements
Front Access: All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External Diagnostics Handset port for local management.
Rear Access: 2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection
Power Supply: Up to 9x hot-swap air-cooled power supplies (2400W Platinum, 2600W Titanium), or Up to 3x hot-swap direct-water-cooled power supplies (7200W Titanium)Supports up to N+1 redundancy
Cooling Design: Direct Water Cooling at the heat source with up to 50C inlet water temperature
OS Support: Red Hat, SUSE, Rocky Linux (with LeSI support); Visit lenovopress.com/osig for more information.
Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)
Lenovo ThinkSystem SD650N V3 High Density Server
Sever Brand: Lenovo
Server Product: ThinkSystem SD650N V3 Server
Form Factor: Full-wide 1U tray; 1 node+GPUs per tray
Chassis: DW612S Enclosure (6U)
Processor Structure: Two 5th Gen Intel Xeon Scalable processors per tray, or 2x Intel Xeon CPU Max Series processors per tray
RAM: Up to 2TB using 16x 128GB 5600MHz TruDDR5 RDIMM slots per tray
I/O Expansion: NVIDIA ConnectX-7 4-chip VPI PCIe Gen5 Mezz Board for GPUdirect I/O
Acceleration: NVIDIA HGX H100 4-GPU with 4x NVLink connected SXM5 GPUs
Storage: Up to 2x 2.5 NVMe SSDs (7mm height) or 1x 2.5 NVMe SSDs (15mm height) per node, Up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions
RAID Support: OS Software RAID
Network Interfaces: Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI)
Power Management: Rack-level power capping and management via open-source management software Confluent and application-level energy optimization through Energy Aware Runtime (EAR)
Systems Management: Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements
Front Access: All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External Diagnostics Handset port for local management.
Rear Access: 2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection
Power Supply: Up to 9x hot-swap air-cooled power supplies (2400W Platinum, 2600W Titanium), or Up to 3x hot-swap direct-water-cooled power supplies (7200W Titanium) Supports up to N+1 redundancy
Cooling Design: Direct Water Cooling at the heat source with up to 45C inlet water temperature
OS Support: Red Hat, SUSE, Rocky Linux (with LeSI support); Visit: lenovopress.com/osig for more information.
Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)
Lenovo ThinkSystem SD665N V3 High Density Server
Sever Brand: Lenovo
Server Product: ThinkSystem SD665N V3 Server
Form Factor: Full-wide 1U tray; 1 node+GPUs per tray
Chassis: DW612S Enclosure (6U)
Processor Structure: 1x or 2x 4th Generation AMD EPYC Processors per node
RAM : Up to 3.0TB using 24x 128GB 4800 MHz TruDDR5 RDIMM slots per tray
I/O Expansion: NVIDIA ConnectX-7 4-chip VPI PCIe Gen5 Mezz Board for GPUdirect I/O
Acceleration: NVIDIA HGX H100 4-GPU with 4x NVLink connected SXM5 GPUs
Storage: Up to 2x 2.5 NVMe SSDs (7mm height) or 1x 2.5 NVMe SSDs (15mm height) per node, Up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions
RAID Support: OS Software RAID
Network Interfaces: Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI)
Power Management: Rack-level power capping and management via open-source management software Confluent and application-level energy optimization through Energy Aware Runtime (EAR)
Systems Management: Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements
Front access: All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External Diagnostics Handset port for local management.
Rear access: 2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection
Power Supply: Up to 9x hot-swap air-cooled power supplies (2400W Platinum, 2600W Titanium), or Up to 3x hot-swap direct-water-cooled power supplies (7200W Titanium) Supports up to N+1 redundancy
Cooling Design: Direct Water Cooling at the heat source with up to 45C inlet water temperature
OS Support: Red Hat, SUSE, Rocky Linux (with LeSI support); Visit lenovopress.com/osig for more information.
Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)
